Sn63 Pb37 high-purity low-melting point solder wire, high-fluidity solder wire, added active rosin core solder, which reduces the thermal shock caused by soldering to components, high insulation resistance, and excellent performance and widely used in various electronic appliances, instruments, USB motherboards, IC motherboards, etc.

Product parameters:

Product name: Leaded solder wire

Melting point: 183°C-288°C

Temperature: 250°C-480°C

Rosin: 2%-2.5%

Purity: 63%

Wire diameter: 0.6mm

Weight: 450g

Product features:

1. High-purity tin ore; high-purity tin ingots, trace impurities, and the surface color of solder wire is silvery white and bright.

2. Less no-cleaning residue; advanced flux formula rosin improves solder fluidity, strengthens tinning ability, and prevents false soldering.

3. Easy tinning and good fluidity; no-cleaning, slippery rosin core, low melting point, strong fluidity, and good wettability.

4. The solder joints are bright and firm; the solder joints are full and bright, with good firmness and excellent oxidation resistance.